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 INTEGRATED CIRCUITS
DATA SHEET
SAA6588 RDS/RBDS pre-processor
Product specification File under Integrated Circuits, IC01 1997 Sep 01
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
FEATURES * Integrated switched capacitor filters * Demodulation of the European Radio Data System (RDS) or the USA Radio Broadcast Data System (RBDS) signal * RDS and RBDS block detection * Error detection and correction * Fast block synchronization * Synchronization control (flywheel) * Mode control for RDS/RBDS processing * Different RDS/RBDS block information output modes (e.g. A-block output mode) * Fast I2C-bus interface * Multi-path detector * Signal quality detector with sensitivity adjustment * Pause detector with pause level and time adjustment * Alternatively oscillator frequency: n x 4.332 MHz (n = 1 to 4) * UART compatible with 17.328 MHz (n = 4) * CMOS device * Single supply voltage * Extended temperature range (-40 to +85 C). GENERAL DESCRIPTION Today most FM radio stations in Europe and meanwhile also many FM/AM radio broadcasting stations in the USA transmit the inaudible European RDS (Radio Data System) or the USA RBDS (Radio Broadcast Data System) informations respectively. Likewise nowadays receivers, most car radios and also some home and portable radios on the market include at least some of the RDS features. The RDS/RBDS system offers a large range of applications by its many functions to be implemented. For car radios the most important are: * Program Service (PS) name * Traffic Program (TP) identification * Traffic Announcement (TA) signal * Alternative Frequency (AF) list * Program Identification (PI) * Enhanced Other Networks (EON) information.
SAA6588
The RDS/RBDS pre-processor is a CMOS device that integrates all RDS/RBDS relevant functions in one chip. The IC contains filtering and demodulation of the RDS/RBDS signal, symbol decoding, block synchronization, error detection, error correction and additional detectors for multi-path, signal quality and audio signal pauses. The pre-processed RDS/RBDS information is available via the I2C-bus. The RDS/RBDS pre-processor replaces a number of ICs and peripheral components used nowadays in car radio concepts with RDS or RBDS features. The integration of the relevant RDS/RBDS data processing functions provides, in an economic manner, high performance of RDS/RBDS processing and reduces the real-time requirements for the main radio microcontroller considerably. In addition it simplifies the development of the RDS specific software for the main controller of the radio set. Compared with standard radio systems, RDS/RBDS controlled radio systems additionally require an RDS/RBDS demodulator with a 57 kHz band-pass filter, information about the current reception situation (reception quality, multi-path disturbance etc.), and additional microcontroller power for RDS/RBDS data processing, decoding and radio control. The new RDS/RBDS pre-processor includes all these specific functions and meets all requirements of a high end RDS/RBDS radio. Moreover the timing requirements of the set controller, regarding RDS/RBDS data processing are reduced due to the integration of decoder functions, so that the development of radio control software can be concentrated specifically on radio set features.
1997 Sep 01
2
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
QUICK REFERENCE DATA SYMBOL VDDA VDDD IDD(tot) Vi(MPX) GSQ CRGSQ tPON(min) fi(xtal) PARAMETER analog supply voltage digital supply voltage total supply current RDS input sensitivity at pin MPX step size for signal quality input gain control range for signal quality input gain minimum time for pause crystal input frequency adjustable in 4 steps n=1 n=2 n=3 n=4 ORDERING INFORMATION TYPE NUMBER SAA6588 SAA6588T PACKAGE NAME DIP20 SO20 DESCRIPTION plastic dual in-line package; 20 leads (300 mil) plastic small outline package; 20 leads; body width 7.5 mm CONDITIONS MIN. 4.5 4.5 - 1 - - 20.2 - - - - TYP. 5.0 5.0 14.0 - 0.6 18.6 - 4.332 8.664 12.996 17.328
SAA6588
MAX. 5.5 5.5 - - - - 161.7 - - - -
UNIT V V mA mV dB dB ms MHz MHz MHz MHz
VERSION SOT146-1 SOT163-1
1997 Sep 01
3
1997 Sep 01
handbook, full pagewidth
BLOCK DIAGRAM
Philips Semiconductors
560 pF C10 SCOUT 18 19 7 CIN VDDD
+5 V C9 100 nF
RDS/RBDS pre-processor
multiplex C1 input CLOCKED COMPARATOR RDS/RDBS DEMODULATOR 11 PSWN RDS/RDBS DECODER 8 DAVN
330 pF
MPX 16
57 kHz 8th ORDER BAND-PASS
data available
C2 audio inputs C3
0.47 F 2 MPTH
0.47 F R2 10 R3 k
10 k
SAA6588
MULTI-PATH DETECTOR 5 4 SIGNAL QUALITY DETECTOR INTERFACE REGISTER 4
pause output multi-path output
AFIN 13
PAUSE DETECTOR
4
TEST CONTROL OSCILLATOR AND CLOCK 1 MRO OSCI Q1 R4 470 k C4 47 pF 5 4 OSCO R1 1 k 3 TCON C6 100 nF 15 VSSA C7 2.2 F Vref 17 6 n x 4.332 MHz n = 1 to 4 C5 82 pF
level input
C11
LVIN 20 9 SDA I2C-BUS SLAVE TRANSCEIVER 12 VSSD MAD 10 SCL I2C-BUS
2.2 nF
+5 V
VDDA 14
C8 100 nF
POWER SUPPLY AND RESET
MGK535
Product specification
SAA6588
Fig.1 Block diagram.
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
PINNING SYMBOL MRO MPTH TCON OSCO OSCI VSSD VDDD DAVN SDA SCL PIN 1 2 3 4 5 6 7 8 9 10 DESCRIPTION multi-path rectifier output multi-path detector output test control input pin oscillator output oscillator input digital ground (0 V) digital supply voltage (5 V) data available output (active LOW) I2C-bus serial data I/O I2C-bus serial clock input SYMBOL PSWN MAD AFIN VDDA VSSA MPX Vref SCOUT CIN LVIN PIN 11 12 13 14 15 16 17 18 19 20
SAA6588
DESCRIPTION pause switch output (active LOW) slave address (LSB) input audio signal input analog supply voltage (5 V) analog ground (0 V) multiplex input signal reference voltage output band-pass filter output comparator input level input
handbook, halfpage
MRO 1
handbook, halfpage
20 LVIN 19 CIN 18 SCOUT 17 Vref 16 MPX
MRO 1 MPTH 2 TCON 3 OSCO 4 OSCI 5
20 LVIN 19 CIN 18 SCOUT 17 Vref 16 MPX
MPTH 2 TCON 3 OSCO 4 OSCI 5
SAA6588T
VSSD 6 VDDD 7 DAVN 8 SDA 9 SCL 10
MGK534
SAA6588
VSSD 6 VDDD 7 DAVN 8 SDA 9 SCL 10
MGK533
15 VSSA 14 VDDA 13 AFIN 12 MAD 11 PSWN
15 VSSA 14 VDDA 13 AFIN 12 MAD 11 PSWN
Fig.2 Pin configuration (DIP20).
Fig.3 Pin configuration (SO20).
1997 Sep 01
5
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
FUNCTIONAL DESCRIPTION General The following functions are performed by the SAA6588: * Selection of the RDS/RBDS signal from the MPX input signal * 57 kHz carrier regeneration * Demodulation of the RDS/RBDS signal * Symbol decoding * RDS/RBDS block detection * Error detection and correction of transmission errors * Fast block synchronization and synchronization control * Detection of multi-path distortion and audio signal pauses * Determination of the signal quality * Mode control of processing and RDS/RBDS data output via I2C-bus interface * Sensing of pause and multi-path, information via extra output pins. The block diagram of the RDS/RBDS pre-processor is shown in Fig.1. For the application of the device only a few external components are required. The pre-processors functional blocks are described in the following sections. RDS/RBDS signal demodulation BAND-PASS FILTER The band-pass filter has a centre frequency of 57 kHz. It selects the RDS/RBDS sub-band from the multiplex signal MPX and suppresses the audio signal components. The filter block contains an analog anti-aliasing filter at the input followed by an 8th order switched capacitor band-pass filter and a reconstruction filter at the output. CLOCKED COMPARATOR The comparator digitizes the output signal from the 57 kHz band-pass filter for further processing by the digital RDS/RBDS demodulator. To attain high sensitivity and to avoid phase distortion, the comparator input stage contains an automatic offset compensation. DEMODULATION
SAA6588
The demodulator provides all functions of the SAA6579 but has improved performance under weak signal conditions. The demodulator includes: * 57 kHz carrier regeneration from the two sidebands (Costas loop) * Symbol integration over one RDS clock period * Bi-phase symbol decoding * Differential decoding * Synchronization of RDS/RBDS output data with clock. The RDS/RBDS demodulator recovers and regenerates the continuously transmitted RDS/RBDS data stream out of the multiplex signal (MPX) and provides the internal signals clock (RDCL) and data (RDDA) for further processing by the RDS/RBDS decoder block. RDS/RBDS data processing The RDS/RBDS data processing of the pre-processor handles the complete processing and decoding of the continuous serial RDS/RBDS demodulator output data stream. Different data processing modes are software controllable by the external main controller via I2C-bus. Processed RDS/RBDS data blocks, decoder status information and signal quality information are also available via I2C-bus. RDS/RBDS DECODER The RDS/RBDS decoder contains: * RDS/RBDS block detection * Error detection and correction * Synchronization * Flywheel for synchronization hold * Bit slip correction * Data processing control * RDS/RBDS data output.
1997 Sep 01
6
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
RDS/RBDS block detection
The RDS/RBDS block detection is always active. For a received sequence of 26 data bits, a valid block and its offset are identified via syndrome calculation. During synchronization search, the syndrome is calculated with every new received data bit (bit-by-bit) for a received 26-bit sequence. If the decoder is synchronized, syndrome calculation is activated only after 26 data bits for each new block received. Under RBDS reception situation, beside the RDS block sequences with (A, B, C/C', D) offset also block sequences of 4 blocks with offset E may be received. If the decoder detects an E-block, this block is marked in the block identification number BL and is available via I2C-bus request. In RBDS processing mode the block is signed as valid E-block and in RDS processing mode, where only RDS blocks are expected, signed as invalid E-block (see Table 13). This information can be used by the main controller to detect E-block sequences and identify RDS or RBDS transmitter stations.
SAA6588
Synchronization
The decoder is synchronized if two successive valid blocks in a valid sequence are detected by the block detection. For detection of the second block of this sequence, error correction is also enabled depending on the pre-selected correction mode (see Table 4). Only valid (correctable) blocks are accepted for synchronization (see also Section "Error detection and correction"). If synchronization is found, the synchronization status flag (SYNC) is set and available via I2C-bus request. The synchronization is held until the flywheel (for synchronization hold) detects a loss of synchronization (see Section "Flywheel for synchronization hold") or an external restart of synchronization is performed (see Section "Data processing control").
Flywheel for synchronization hold
For a fast detection of loss of synchronization the internal flywheel counter checks the number of uncorrectable blocks (error blocks). Error blocks increment and valid blocks decrement the block error counter. The flywheel counter is only active if the decoder is synchronized. The synchronization is held until the flywheel counter detects an error block overflow (loss of synchronization). The maximum value for the error block counter is adjustable via I2C-bus in a range of 0 to 63 (see Table 6). The value 32 is set after reset and the values 0 and 63 have a special function. * If the value 0 is programmed then no flywheel is active * If the value 63 is programmed then the flywheel is endless and no new start of synchronization is effected automatically (synchronization hold).
Error detection and correction
The RDS/RBDS error detection and correction recognizes and corrects potential transmission errors within a received block via parity-check in consideration of the offset word of the expected block. Burst errors with a maximum length of 5 bits are corrected with this method. After synchronization has been found the error correction is always active, but cannot be carried out in every reception situation. During synchronization search, the error correction is disabled for detection of the first block and is enabled for processing of the second block depending on the pre-selected error correction mode for synchronization (mode SYNCA to SYNCC, see Table 4). The processed block data and the status of error correction are available for data request via I2C-bus for the last two blocks. Processed blocks are characterized as uncorrectable under the following conditions: * During synchronization search, if the burst error is higher than allowed by the pre-selected correction mode. * After synchronization has been found, if the burst error is higher than 5 bits or if errors are detected but error correction is not possible. 1997 Sep 01 7
Bit slip correction
During poor reception situation phase shifts of one bit to the left or right (1 bit slip) between the RDS/RBDS clock and data may occur, depending on the lock conditions of the demodulators clock regeneration. If the decoder is synchronized and detects a bit slip, the synchronization is corrected by +1 or -1 bit via block detection on the respectively shifted expected new block.
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
Data processing control
The pre-processor provides different operating modes selectable via the external I2C-bus. The data processing control performs the pre-selected operating modes and controls the requested output of the RDS/RBDS information. Restart of synchronization mode: The `restart synchronization' (NWSY) control mode immediately terminates the actual synchronization and restarts a new synchronization search procedure. The NWSY flag is automatically reset after the restart of synchronization by the decoder. This mode is required for a fast new synchronization on the RDS/RBDS data from a new transmitter station if the tuning frequency is changed by the radio set. Restart of synchronization search is furthermore automatically carried out if the internal flywheel signals a loss of synchronization (see Section "Flywheel for synchronization hold"). Error correction control mode for synchronization: For error correction and identification of valid blocks during synchronization search, three different modes are selectable. (SYM1, SYM0, see Table 4). RBDS processing mode: The pre-processor is suitable for receivers intended for the European (RDS) as well as for the USA (RBDS) standard. If RBDS mode is selected via the I2C-bus, the block detection and the error detection and correction are adjusted to RBDS data processing. Data available control mode: The pre-processor provides three different RDS/RBDS data output processing modes selectable via the `data available' control mode: (see also Section "RDS/RBDS data output" and Table 5). Standard processing mode: if the decoder is synchronized and a new block is received (every 26 bits), the actual RDS/RBDS information of the last two blocks is available with every new received block. Fast PI search mode: during synchronization search and if a new A-block is received, the actual RDS/RBDS information of this or the last two A-blocks respectively is available with every new received A-block. If the decoder is synchronized, the standard processing mode is valid. Reduced data request processing mode: if the decoder is synchronized and two new blocks are
SAA6588
received (every 52 bits), the actual RDS/RBDS information of the last two blocks is available with every two new received blocks. The RDS/RBDS pre-processor provides data output of the block identification, the RDS/RBDS information words and error detection and correction status of the last two blocks as well as signal quality indication and general decoder status information. In addition, the decoder controls also the data request from the external main controller. The pre-processor activates the `data overflow' status flag DOFL (see Section "Programming"), if the decoder is synchronized and a new RDS/RBDS block is received before the previously processed block was completely transmitted via I2C-bus. After detection of data overflow the interface registers are not updated until reset of the data overflow flag by reading via the I2C-bus.
RDS/RBDS data output
The decoded RDS/RBDS block information and the current pre-processor status is available via the I2C-bus. For synchronization of data request between main controller and pre-processor the additional data available output signal is used. If the decoder has processed new information for the main controller the data available signal (DAVN) is activated (LOW) under the following conditions (see also Table 5): * During synchronization search in DAVB mode if a valid A-block has been detected. This mode can be used for fast search tuning (detection and comparison of the PI code contained in the A-block). * During synchronization search in any DAV mode, if two blocks in correct sequence have been detected (synchronization criterion). * If the pre-processor is synchronized and in mode DAVA and DAVB a new block has been processed. This mode is the standard data processing mode, if the decoder is synchronized. * If the pre-processor is synchronized and in DAVC mode two new blocks have been processed. * If the pre-processor is synchronized and in any DAV mode loss of synchronization is detected (flywheel counter overflow and resulting restart of synchronization). * In any DAV mode, if a reset condition caused by power-on or voltage-drop is detected.
1997 Sep 01
8
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
The processed RDS/RBDS data are available for I2C-bus request for at least 20 ms after the DAVN signal was activated. The DAVN signal is always automatically deactivated (HIGH) after 10 ms or almost after the main controller has read the RDS/RBDS data via I2C-bus (see Fig.4). The decoder ignores new processed RDS/RBDS blocks if the DAVN signal is active or if data overflow occurs (see Section "Data processing control"). Multi-path detector The multi-path detector takes its information from the unweighted level signal of the FM IF amplifier, input LVIN (see Fig.1). The part of frequency components around 21 kHz is selected by a band-pass filter and rectified by a full-wave rectifier. The capacitor at pin MRO is the charge capacitor. In combination with internal current sources the time constants of the rectifier are defined. The analogous output voltage of the multi-path rectifier is buffered and available via pin MPTH. Signal quality detector The signal quality detector takes its information from the multiplex signal. Disturbances caused by adjacent-channel reception, noise, or multi-path, generate high frequency components (noise) on the multiplex signal besides the audible distortion. The signal quality measurement is provided for fast testing alternative frequencies as well as for the tuned frequency. It is a short start/stop procedure. The measuring time is limited to 850 s. To attain an average value over a longer time, multiple measurements are possible with integration by software processing. The noise is detected from the frequency spectrum above 90 kHz. The noise voltage is selected by a 4th order high-pass filter. A full-wave rectifier, controlled by this noise voltage, charges an initially discharged capacitor (on chip). The time is measured until the voltage across the capacitor has reached a defined threshold value. Then that time equivalent value is stored. The resolution of the signal quality measurement is 4 bits (16 steps). For operating the noise detector two modes are provided, the triggered mode and the continuous mode. The mode is defined by the bit SQCM (Signal Quality Continuous Measurement) as described in Section "Programming". The triggered mode is provided for a fast signal quality test of e.g. an alternative frequency. After the alternative
SAA6588
frequency has been tuned, the signal quality detector has to be started (triggered) by transmitting the bits SQCM = 0 and TSQD = 1 via the I2C-bus (see Fig.5). This causes a single shot measurement immediately after the acknowledgement of this byte. The bit TSQD is internally reset during the measurement (TSQD = 0). The result of the measurement is stored and is available for reading out, as long as no new measurement is started again e.g. after tuning back to the previous frequency. The continuous mode minimizes the required I2C-bus activities for multiple measurements. After transmission of SQCM = 1 and TSQD = 1, the signal quality detector starts a new measurement as described above. But every time after finishing one measuring procedure the result is stored (overwrites the previous value within the I2C-bus buffer SQI3 to SQI0) and a new measurement starts automatically. If at any time the pre-processor is read out by his master, the last measured value will be transmitted. After transmitting the control information SQCM = 0 and TSQD = 0, the measurement activity will be stopped. A previously started but not yet finished measurement will be completed and this last result will also be available. The control bit combination SQCM = 1 and TSQD = 0 must not be used. It is reserved for later applications. At a maximum time of 850 s after triggering or automatic restart of the signal quality detector, the result of the measurement (signal quality indication) is available and represented by the four bits SQI3 to SQI0, in a value range of 0 to 15 and is available via the I2C-bus (see Section "Programming"). The result 0 characterizes no or less noise/distortion and 15 high noise/distortion. Tolerances of the signal quality detector as well as characteristics and tolerances of the FM IF amplifier can be compensated by adjusting the sensitivity of the signal quality detector with the control bits SQS0 to SQS4. The sensitivity can be adjusted over a range of 18.6 dB (-9.0 to +9.6 dB) in steps of 0.6 dB as given in Table 10. Pause detector The pause detector watches the audio modulation for pauses or very low levels. This function can be used for performing inaudible RDS AF-tests if the radio is in FM mode as well as for Automatic Music Search (AMS) if the radio is in cassette mode. The input of the pause detector (AFIN) is low-ohmic and must be current driven (negative input of an operational amplifier). This has the following advantages:
1997 Sep 01
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Philips Semiconductors
Product specification
RDS/RBDS pre-processor
* One (MPX) as well as two (left and right) AF channel application is possible and requires only one pin * Unwanted crosstalk is avoided if two AF channel application is chosen * Matching the input sensitivity is possible by external resistors. For combined application (RDS and AMS) variations of the switching threshold level as well as the minimum time for pause detection are possible via I2C-bus control. The level can be adjusted in four steps of 4 dB by the control bits PL0 and PL1, see Table 8 (for 1 channel: R = 5 k; for 2 channels: R = 10 k). The corresponding values of FM deviation are calculated for stereo decoders with an output voltage of 270 mV at 22.5 kHz deviation. The minimum time for detecting a pause can be adjusted by the control bits SOSC, PTF0 and PTF1, see Table 9. The minimum time for detecting `no pause' is fixed to 5 ms to avoid interruptions of a pause by a short pulse. The output signal of the pause detector is a digital switching signal (active LOW). It is directly available via the output pin PSWN. A detected pause may initiate an AF search if required (FM mode). Oscillator and clock For good performance of the band-pass and demodulator stages, the pre-processor requires a crystal oscillator with a frequency of n x 4.332 MHz. The pre-processor can be operated with one of four different oscillator frequencies (n = 1 to 4). The 17.328 MHz frequency (n = 4) is also UART interface compatible for 8051 based microcontrollers with a 9600 baud rate (frequency error = 4.5%), so that a radio set with microcontroller can run in this case with one crystal only. The pre-processor oscillator can drive the microcontroller or vice versa. According to the used oscillator frequency, the mode control bits PTF1, PTF0 and SOSC have to be set via the I2C-bus after every reset, see Section "Programming" The clock generator circuitry generates hereof the internally used 4.332 MHz system clock and further derived timing signals. Power supply and reset The pre-processor has separate power supply inputs for the digital and analog parts of the device. For the analog functions an additional reference voltage (12VDDA) is internally generated and available via the output pin Vref. 1997 Sep 01 10
SAA6588
The I2C-bus interface requires a defined reset condition. The pre-processor generates a reset signal: * After the supply voltage VDDD is switched on * At a supply voltage-drop * If the oscillator frequency is lower than 400 Hz. This internal reset initializes the I2C-bus interface registers as well as the I2C-bus slave control and releases the data line SDA (SDA = HIGH) for input of control mode settings from the main controller. If the decoder detects a reset condition, the status information `reset detected' (RSTD) is set and available via I2C-bus request. The RSTD flag is deactivated after the decoder status register was read by the I2C-bus. This status information is important to signal the main controller about a voltage-drop in the pre-processor IC. By default, the bits in the write registers (except bit SOSC) are set to the values in Table 11. If these values are the required values, no further initialization is necessary. Programming I2C-BUS SLAVE TRANSCEIVER For communication with the external main controller (master transceiver) the standard I2C-bus is used. The pre-processors I2C-bus interface acts as a slave transceiver with fast mode option, that allows a transfer bit rate up to 400 kbits/s but is also capable of operating at lower rates (100 kbits/s). The I2C-bus interface is connected to the external I2C-bus via the serial clock line SCL and the serial data line SDA. The clock line is supplied by the master and is only input for the slave transceiver. The data line is a serial 8-bit oriented bidirectional data transfer line, and acts as input for control mode settings from the main controller to the pre-processor, as output for requested RDS/RBDS data from the pre-processor to the main controller and acknowledge between pre-processor and main controller. The transfer of requested data to the main controller is synchronized via the additional data available output signal DAVN to avoid loss of RDS/RBDS data. The DAVN signal is activated if the pre-processor has provided new data information for the main controller (see Section "RDS/RBDS data output") and can be used for the polling mode as well as for the interrupt mode of the main microcontroller.
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
I2C-BUS INTERFACE REGISTERS The I2C-bus interface is connected to other blocks of the pre-processor via internal registers (byte oriented). Those can either be written by the pre-processor control and read by the main controller I2C-bus or vice versa. The device provides 3 input control registers to which may be written via the I2C-bus and 7 output registers which may be read via the I2C-bus. The decoder control updates the output registers after the detection of a new RDS/RBDS information block and reads the new mode control settings of the input control registers. Both operations may occur in the same time slot, provided that the read operation is complete before a new RDS/RBDS data bit is processed by the demodulator. For the corresponding access the registers are addressed by two separate register pointers, write-enable and read-enable signals, which are activated either via the decoder control or via the I2C-bus interface control. During a read or write transmission from the I2C-bus the read/write pointer selects the register of the first byte for transmission and is auto-incremented by the I2C-bus control for the transfer of subsequent bytes. During a write transmission after reception of the device slave address and write bit, the mode control settings for the pre-processor have to be send in the protocol sequence as shown in Table 1 and Fig.5. During a read cycle after reception of the device slave address and read bit the requested RDS/RBDS data has to be received in the protocol sequence as given in Table 2 and Fig.7. Table 1 Input control registers FUNCTION initialization and mode control setting; see Table 3 pause level and flywheel setting; see Table 6 pause time/oscillator frequency and quality detector sensitivity setting; see Table 7 Table 2 Output registers
SAA6588
DATA Byte 0R Byte 1R Byte 2R Byte 3R Byte 4R Byte 5R Byte 6R
FUNCTION decoder and data status information; see Table 12 last processed block (HIGH byte); see Table 15 last processed block (LOW byte); see Table 15 previously processed block (HIGH byte); see Table 15 previously processed block (LOW byte); see Table 15 error status information; see Table 15 signal quality indication; see Table 15
WRITE TRANSMISSION FORMAT Table 3 Description of initialization and mode control byte (byte 0W) FUNCTION 1: signal quality continuous measurement 6 TSQD 0: no determination of signal quality 1: trigger of signal quality detector measurement 5 4 3 2 1 0 NWSY 0: normal processing mode 1: restart of synchronization SYM1 selection of error correction mode for SYM0 synchronization search; see Table 4 RBDS 0: RDS processing mode 1: RBDS processing mode DAC1 selection of data output protocol and DAC0 indirectly control of data available output signal (DAVN); see Table 5
BIT NAME 7
SQCM 0: triggered signal quality measurement
DATA Byte 0W Byte 1W Byte 2W
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Philips Semiconductors
Product specification
RDS/RBDS pre-processor
Table 4 SYM1 0 0 1 1 Selection of error correction mode for synchronization search SYM0 0 1 0 1 MODE SYNCA SYNCB SYNCC SYNCD DESCRIPTION no error correction error correction of a burst error maximum 2 bits
SAA6588
error correction of a burst error maximum 5 bits no error correction; no E-E block sequence allowed (for RBDS mode, E-A or D-E block sequences are still allowed)
Table 5 DAC1 0
Selection of data output protocol and DAVN signal DAC0 0 MODE DAVA FUNCTION standard processing mode DESCRIPTION RDS standard output mode; synchronization search: DAVN = HIGH; synchronized: block information available and DAVN active after detection of a new block (every 26 bits) synchronization search: for fast PI search, block information available and DAVN active only if a correct A-block is detected; synchronized: same as standard DAVA mode synchronization search: DAVN inactive = HIGH; synchronized: block information available and DAVN active only after detection of two new blocks (every 52 bits) -
0
1
DAVB
fast PI search mode reduced data request processing mode -
1
0
DAVC
1 Table 6 BIT 7 6 5 to 0 Table 7 BIT 7 6 5 4 to 0 Table 8 PL1 0 0 1 1
1
-
Description of pause level and flywheel setting bytes (byte1W) NAME PL1 PL0 FEB5 to FEB0 maximum number of error blocks for synchronization hold flywheel (0 to 63) FUNCTION level sensitivity for pause detection; see Table 8
Description of pause time/oscillator frequency and quality detector sensitivity setting (byte 2W) NAME PTF1 PTF0 SOSC SQS4 to SQS0 FUNCTION time criteria for pause (20 to 160 ms); see Table 9 oscillator frequency: n x 4.332 MHz (n = 1 to 4); see Table 9 0: set pause time criteria via PFT1 and PFT0 1: select oscillator frequency via PFT1 and PFT0 adjustment of signal quality detector sensitivity (-9 to +9.6 dB); see Table 10
Control bits PL0 and PL1 PL0 0 1 0 1 PAUSE LEVEL (mV RMS) 11 17 27 43 BELOW DOLBY LEVEL (dB) 30.2 26.2 22.2 18.2 FM DEVIATION (kHz) 1.0 1.6 2.5 4.0
1997 Sep 01
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Philips Semiconductors
Product specification
RDS/RBDS pre-processor
Table 9 Control bits SOSC, PTF0 and PTF1 SOSC = 0 SOSC 0 0 0 0 PTF1 0 0 1 1 PTF0 0 1 0 1 MINIMUM TIME (ms) 20.2 40.4 80.8 161.7
SAA6588
SOSC = 1 OSCILLATOR FREQUENCY (MHz) 4.332 (n = 1) 8.664 (n = 2) 12.996 (n = 3) 17.328 (n = 4)
Table 10 Control bits SQS0 to SQS4 SQS SQS4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1997 Sep 01 SQS3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 SQS2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 SQS1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 SQS0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 13 HEX 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F CORRECTION (dB) -9.0 -8.4 -7.8 -7.2 -6.6 -6.0 -5.4 -4.8 -4.2 -3.6 -3.0 -2.4 -1.8 -1.2 -0.6 0 +0.6 +1.2 +1.8 +2.4 +3.0 +3.6 +4.2 +4.8 +5.4 +6.0 +6.6 +7.2 +7.8 +8.4 +9.0 +9.6
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
Table 11 Default values of the write register bits after reset BIT SQCM TSQD NWSY VALUE 0 0 1 COMMENTS triggered signal quality measurement no determination of signal quality restart of synchronization no error correction during synchronization RDS processing mode pause level 12 mV DAVA mode RDS standard output mode oscillator frequency = 4.332 MHz (SOSC = 1); pause time = 20.2 ms (SOSC = 0) gain = 0 dB 1 1 1
SAA6588
Table 13 Block identification number (last detected block) BL2/ BP2 0 0 0 0 1 1 1 BL1/ BP1 0 0 1 1 0 0 1 BL0/ BP0 0 1 0 1 0 1 0 BLOCK IDENTIFICATION block A block B block C block D block C' block E (RBDS mode) invalid block E (RDS mode) invalid block
SYM1 and SYM0 00 RBDS PL1 and PL0 0 00
DAC1 and DAC0 00 FEB5 to FEB0 PTF1 and PTF0
100000 flywheel = 32 decimal 00
Table 14 Processed error correction ELB1/ EPB1 0 0 1 1 ELB0/ EPB0 0 1 0 1 MODE ERDA ERDB ERDC ERDD DESCRIPTION no errors detected burst error of maximum 2 bits corrected burst error of maximum 5 bits corrected uncorrectable block
SQS4 to SQS0
01111
READ TRANSMISSION FORMAT Table 12 Description of decoder and data status information byte (byte 0R) BYTE 0R BIT NAME FUNCTION
Table 15 Bytes 1R to 6R BYTE 1R 2R 3R 4R 5R BIT 7 to 0 7 to 0 7 to 0 7 to 0 7 to 2 1 0 6R 7 to 5 NAME M15 to M08 M07 to M00 PM15 to PM08 PM07 to PM00 BEC5 to BEC0 EPB1 EPB0 BP2 to BP0 - SQI3 to SQI0 FUNCTION HIGH byte of last processed block LOW byte of last processed block HIGH byte of previously processed block LOW byte of previously processed block number of counted block errors (0 to 63) error status of previously processed block; see Table 14 block identification number of previous processed block; see Table 13 not used (undefined) signal quality indication (0 to 15)
7 to 5 BL2 to BL0 block identification number of last processed block; see Table 13 4 3 2 1 0 SYNC DOFL RSTD ELB1 ELB0 0: not synchronized 1: synchronized 0: no data overflow 1: data overflow detected 0: no reset detected 1: reset detected error status of last processed block; see Table 14
4 3 to 0
1997 Sep 01
14
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD Vn Ii PARAMETER supply voltage voltage at pins 1 to 5, 8 to 13, and 16 to 20 with respect to pins 6 and 15 input current pins 1 to 5, 8, 10 to 13 and 16 to 20 pin 9 Ilu(prot) latch-up protection current in pulsed mode -10 -20 Tamb = -40 to +85 C with -100 voltage limiting -2 to +10 V Tamb = 25 C with voltage limiting -2 to +12 V Tamb = -40 to +85 C without voltage limiting Tamb Tstg Ves operating ambient temperature storage temperature electrostatic handling note 1 note 2 Notes -200 -10 -40 -65 -4000 -250 +10 +20 +100 +200 +10 +85 +150 +4000 +250 CONDITIONS 0 -0.5 MIN. 6.5
SAA6588
MAX.
UNIT V
VDD + 0.5 6.5 V
mA mA mA mA mA C C V V
1. Human body model (equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor). Except pin 17: -4000 V minimum and +2500 V maximum. 2. Machine model (equivalent to discharging a 200 pF capacitor through a 0 series resistor and 0.75 H inductance). THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient SAA6588T (SOT163-1) SAA6588 (SOT146-1) CONDITIONS in free air 85 62 K/W K/W VALUE UNIT
1997 Sep 01
15
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
CHARACTERISTICS DIGITAL PART VDDA = VDDD = 5 V; Tamb = 25 C; unless otherwise specified. SYMBOL Supply VDDD IDDD Ptot Inputs VIL1 VIL2 VIH1 VIH2 ILI Ii(pu) Outputs VOL1 VOL2 VOH LOW-level output voltage at pins DAVN, PSWN and OSCO LOW-level output voltage at pin SDA HIGH-level output voltage at pins DAVN, PSWN and OSCO IOL = 2 mA IOL1 = 4.0 mA IOL2 = 6.0 mA IOH = -2 mA - - - 4.0 - - - - 0.4 0.4 0.6 - LOW-level input voltage at pins TCON, OSCI and MAD LOW-level input voltage at pins SCL and SDA HIGH-level input voltage at pins TCON, OSCI and MAD HIGH-level input voltage at pins SCL and SDA input leakage current at pins TCON, SCL and SDA input pull-up current at pin MAD VDDD = 4.5 to 5.5 V VMAD = 0 to VDDD VMAD = VIL1 VMAD = 3.5 V VDDD = 4.5 to 5.0 V VDDD = 5.0 to 5.5 V - -0.5 -0.5 - - - digital supply voltage digital supply current total power dissipation 4.5 - - 5.0 6.0 70 5.5 - - PARAMETER CONDITIONS MIN. TYP.
SAA6588
MAX.
UNIT
V mA mW
0.3VDDD +1.5 +0.3VDDD -
V V V V
0.7VDDD - 3.0 - -30 - - - -20 -20
VDDD + 0.5 V 10 - -10 A A A
V V V V
Crystal parameters fi(xtal) crystal input frequency n=1 n=2 n=3 n=4 fosc fosc(T) CL Rxtal adjustment tolerance of oscillator frequency temperature drift of oscillator frequency load capacitance crystal resonance resistance fosc 12.996 MHz fosc = 17.328 MHz Tamb = -40 to +85 C - - - - - - - - - 4.332 8.664 12.996 17.328 - - 30 - - - - - - 30 30 - 120 60 MHz MHz MHz MHz ppm ppm pF
1997 Sep 01
16
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
CHARACTERISTICS ANALOG PART VDDA = VDDD = 5 V; Tamb = 25 C; measurements taken in Fig.1; unless otherwise specified. SYMBOL Supply VDDA analog supply voltage 4.5 - - VDDA = 5 V 2.25 - f = 1.2 kHz RDS-signal; f = 3.2 kHz spurious signal f = 57 2 kHz f < 50 kHz f < 15 kHz f > 70 kHz Ri(MPX) fc B-3dB GMPX sb input resistance f = 0 to 100 kHz Tamb = -40 to +85 C f = 57 kHz f = 7 kHz f < 45 kHz f < 20 kHz f > 70 kHz Ro(SCOUT) Vi(min)(rms) Ri Zi(LVIN) Vi(LVIN) fc(MPD) output resistance at pin SCOUT f = 57 kHz Comparator input (pin CIN) minimum input level (RMS value) input resistance f = 57 kHz - 70 1 110 57 kHz band-pass filter centre frequency -3 dB bandwidth signal gain stop band attenuation 56.5 2.5 17 31 40 50 40 - 57.0 3.0 20 - - - - 30 5.0 0 14.0 2.5 25 - - - - - - PARAMETER CONDITIONS MIN. TYP.
SAA6588
MAX.
UNIT
5.5 0.5 - 2.75 - - - - - - -
V V mA V k
VDDA - VDDD voltage difference between analog and digital supply IDD(tot) Vref Zo(Vref) Vi(MPX)(rms) Vi(max)(p-p) total supply current reference voltage output impedance at pin Vref RDS amplitude (RMS value) maximum input signal capability (peak-to-peak value)
MPX input (signal before the capacitor on pin MPX) 1 200 1.4 2.8 3.5 33 mV mV V V V k
57.5 3.5 23 - - - - 60
kHz kHz dB dB dB dB dB
10 150
mV k
Multi-path detector (pins LVIN, MPTH and MRO) input impedance at pin LVIN input voltage at pin LVIN centre frequency of the multi-path detector band-pass filter bandwidth of the multi-path detector band-pass filter stop band attenuation attack time of the rectifier f = 11 kHz f = 31 kHz tatt(MRO) 1997 Sep 01 C6 = 100 nF; R4 = 470 k 17 f = 21 kHz 24 1.0 20 30 2.5 21 36 4.0 22 k V kHz
BMPD sb
3.6 16 12 -
4.0 - - 6.4
4.4 - - -
kHz dB dB ms
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
SAA6588
SYMBOL tdec(MRO) Gv(MPTH)
PARAMETER decay time of the rectifier rectifier voltage gain; V MPTH(DC) G v(MPTH) = 20 log ------------------------V LVIN(rms) output impedance at pin MPTH output voltage swing at pin MPTH load impedance at pin MPTH load capacitance at pin MPTH
CONDITIONS C6 = 100 nF; R4 = 470 k VLVIN(rms) = 0.1 V; fLVIN = 21 kHz
MIN. - -
TYP. 50 20
MAX. - -
UNIT ms dB
Zo(MPTH) Vo(MPTH) ZL(MPTH) CL(MPTH) fco PBRR sb VSTEP2-3(rms)
150 0.5 with respect to ground with respect to ground 5 -
200 - - -
250 3.5 - 20
V k pF
Signal quality detector (pin MPX) cut-off frequency pass-band ripple rejection stop band attenuation input voltage (RMS value) for transition of signal quality indication between step 2 and 3 (SQI = 0010 and 0011) step size for signal quality input gain control range for signal quality input gain measuring time after acknowledgement of the I2C-bus transceiver f = 40 kHz sensitivity = 0 dB (SQS = 01111; see Table 10); f = 100 kHz 85 - 30 - 90 - - 85 95 1 - - kHz dB dB mV
GSQ CRGSQ tSQD
0.4 15.6 -
0.6 18.6 -
0.8 21.6 850
dB dB s
Pause detector (pins AFIN and PSWN) Zi(AFIN) VI(AFIN) Ith(rms) THpause(step) THpause(R) Ii(offset) tPON(min) input impedance DC input voltage AC input current for threshold (RMS value) step size for pause threshold control range for pause threshold input offset current minimum time for pause PT1 = 0; PT0 = 0 PT1 = 0; PT0 = 1 PT1 = 1; PT0 = 0 PT1 = 1; PT0 = 1 tPOFF(min) t minimum time for no pause time error (all values) f = 10 kHz unloaded PL1 = 1; PL0 = 1 - - 3.1 3 10 - - - - - - - - Vref 4.4 4 12 - 20.2 40.4 80.8 161.7 5 - 10 - 6.2 5 14 0.4 - - - - - 1.0 V A dB dB A ms ms ms ms ms ms
1997 Sep 01
18
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
I2C-BUS PROTOCOL I2C-bus format In communication with the pre-processor two basic types of I2C-bus protocols are allowed (see Tables 16 and 17). Every transmission begins with a START condition `S' followed by the 7-bit slave address and the R/W mode bit, all generated by the external master. The 6 higher bits of the pre-processors slave address are fixed to 001000. The least significant bit of the slave address can be set via the external input pin MAD to Table 16 Transmitting to the pre-processor (write transfer) S(1) Notes 1. S = START condition. 2. Slave address (depends on level at pin MAD) = 0010000 or 0010001. 3. W = write mode. 4. A = acknowledge bit (SDA = LOW). 5. Subsequently data bytes 0W, 1W and 2W. 6. P = STOP condition. Table 17 Receiving from the pre-processor (read transfer) S(1) Notes 1. S = START condition. 2. Slave address (depends on level at pin MAD) = 0010000 or 0010001. 3. R = read mode. SLAVE ADDRESS(2) R(3) A(4) DATA(5) A(4) DATA(5) SLAVE ADDRESS(2) W(3) A(4) DATA(5) A(4) DATA(5) A(4) DATA(5)
SAA6588
enable a variation if the slave address is already occupied by another device of the radio set. Data is transferred with the most significant bit (MSB) first. Each transmitted byte is followed by an acknowledge bit `A' (SDA = LOW). Every transmission is completed with a STOP condition `P' generated by the master. During read or write transfer the master can abridge the data transfer by generation of a STOP condition. In case of transmission errors during a write cycle, the pre-processor can indirectly stop the transfer by generating no acknowledge (SDA = HIGH) hereafter the master can send the STOP condition.
A(4)
P(6)
A(6)
P(7)
4. A = acknowledge bit (SDA = LOW). Six DATA-acknowledge sequences must occur before the DATA-not acknowledge sequence. 5. Subsequently data bytes 0R to 6R. 6. A = no acknowledge (SDA = HIGH). 7. P = STOP condition.
1997 Sep 01
19
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
Timing data
SAA6588
handbook, full pagewidth
tDAVL DAVN tDVL tTDAV tDV
DATA
MGK540
a. No I2C-bus request during DAVN LOW-time (decoder is synchronized).
handbook, full pagewidth
pre-processor addressed I2C-BUS
tDAVL DAVN tDVL tTDAV tDV
DATA
MGK541
b. DAVN LOW-time shortened by data-request via I2C-bus (decoder is synchronized).
Fig.4 Data available signal (DAVN).
Table 18 Data available signal (DAVN) SYMBOL tDVL tTDAV tDV tDAVL PARAMETER data valid to DAVN LOW data valid period data valid data available signal is LOW 2.0 21.9 21.9 10.1(1) depends on data request via Notes 1. See Fig.4a. 2. See Fig.4b. 1997 Sep 01 20 I2C-bus(2) TYP. s ms ms ms ms UNIT
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
PROGRAMMING AND I2C-BUS SUMMARY
SAA6588
handbook, full pagewidth
START condition from master
slave address + write-bit from master
acknowledgement from slave
S
0
0
1
0
0
0
MAD
0
A
byte 0W from master
acknowledgement from slave
SQCM TSQD NWSY SYM1 SYM0 RBDS DAC1 DAC0
A
byte 1W from master
acknowledgement from slave
PL1
PL0
FEB5 FEB4 FEB3 FEB2 FEB1 FEB0
A
byte 2W from master
acknowledgement from slave
PTF1 PTF0 SOSC SQS4 SQS3 SQS2 SQS1 SQS0
A
P
MGK538
STOP condition from master
Fig.5 RDS pre-processor control commands: mode control and preset settings for the pre-processor.
handbook, full pagewidth
START condition from master
slave address + write-bit from master
acknowledgement from slave
S
0
0
1
0
0
0
MAD
0
A
byte 0W from master
acknowledgement from slave
SQCM TSQD
1
SYM1 SYM0 RBDS DAC1 DAC0
A
P
MGK539
STOP condition from master
Fig.6
RDS pre-processor control commands: abridged protocol, for example for immediate restart synchronization.
1997 Sep 01
21
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
SAA6588
handbook, full pagewidth START condition
from master
slave address + read-bit from master
S
0
0
1
0
0
0
MAD
1
A
byte 0R from device
BL2
BL1
BL0
SYNC DOFL RSTD ELB1 ELB0
A
higher byte of last processed block from device
M15
M14
M13
M12
M11
M10
M09
M08
A
lower byte of last processed block from device
M07
M06
M05
M04
M03
M02
M01
M00
A
higher byte of previous processed block from device
PM15 PM14 PM13 PM12 PM11 PM10 PM09 PM08
A
lower byte of previous processed block from device
PM07 PM06 PM05 PM04 PM03 PM02 PM01 PM00
A
byte 5R from device
BEC5 BEC4 BEC3 BEC2 BEC1 BEC0 EPB1 EPB0
A
byte 6R from device not used
not acknowledged from master
BP2
BP1
BP0
SQI3
SQI2
SQI1
SQI0
A
P
MGK537
STOP condition from master
Fig.7 Data output protocol (RDS data output).
1997 Sep 01
22
k, full pagewidth
1997 Sep 01
(1)
C18 1 nF
S_DAVN R4
(1)
Philips Semiconductors
(1)
C1 1.5 nF +5 V
(1) (2) (1) (3)
APPLICATION DIAGRAM
S_SDA
(1)
470 L1 R5 270
(1) (3)
(1) (3)
C2 220 pF C6 47 F R3 10 11 10 SDA DAVN 8 VDDD VSSD OSCI R8 4 OSCO 1 k SCOUT 18 C12 560 pF CIN 19 3 TCON HC49/U Q1 (4) C16 82 pF C14 100 nF 5 R11 10 (1) MAD 12 9 PSWN SCL R6 270
R7 470
S_SCL
(1) (3)
C3 220 pF
S_PSWN
RDS/RBDS pre-processor
(1)
C4 1.5 nF AFIN 13 R1 10 k VDDA 14 7 100 nF VSSA 15 6 MPX 16 C11 Vref 17 2.2 F C7 470 nF C8 C9 470 nF R2 10 k
+5 V
GND
GND
(1)
C51 470 pF C10 330 pF
23
SAA6588
2 MPTH C13 LVIN 2.2 nF R9
(1)
AF1
AF2
C15 47 pF
MUX
LVL
S_MPTH
20
1
MRO C17 100 nF R10 470 k
MGK536
1 k
(1) (2) (3) (4)
Components for suppression of electromagnetic emission (EME). L1 = type EMIFIL, part number BLM21A102S (MURATA) or equivalent. Values for standard mode I2C-bus. Necessary pull-up resistors of 1.8 k are part of the I2C-bus interface. Q1: 4.332 MHz, 8.664 MHz, 12.996 MHz or 17.328 MHz.
Product specification
SAA6588
Fig.8 Application diagram.
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
PACKAGE OUTLINES DIP20: plastic dual in-line package; 20 leads (300 mil)
SAA6588
SOT146-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 20 11 MH wM (e 1)
pin 1 index E
1
10
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.10
e1 7.62 0.30
L 3.60 3.05 0.14 0.12
ME 8.25 7.80 0.32 0.31
MH 10.0 8.3 0.39 0.33
w 0.254 0.01
Z (1) max. 2.0 0.078
26.92 26.54 1.060 1.045
6.40 6.22 0.25 0.24
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC EIAJ SC603 EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-05-24
1997 Sep 01
24
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
SAA6588
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1997 Sep 01
25
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
SAA6588
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1997 Sep 01
26
Philips Semiconductors
Product specification
RDS/RBDS pre-processor
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
SAA6588
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1997 Sep 01
27
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547027/1200/01/pp28
Date of release: 1997 Sep 01
Document order number:
9397 750 02267


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